The course includes engaging hardware design projects like a cascaded multi-level inverter and a three-phase diode-clamped multi-level inverter, both employing the multisite PWM technique. A multi-output multipurpose DMPS FLYBACK converter utilizing the FSL136 semiconductor chip is also part of the curriculum. These projects, presented at an IEEE conference, reflect a strong academic and technical focus.
The reviewer benefited from a 60% tuition fee scholarship through LPUNEST and an additional MOMA scholarship from the Union Government. The scholarship process is simple, with the scholarship department managing documentation and providing updates. Funds are directly transferred to the institution or the recipient's bank account.
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